„TSMC 7nm EUV“ procesas, pradedant masinę gamybą 2019 m. Kovo mėn



TSMC is giving final touches to set its flagship 7 nanometer EUV (extreme ultraviolet lithography) silicon fabrication node at its highest state of readiness for business, called mass-production. At this state, the node can mass-produce products for TSMC's customers. TSMC had taped out its first 7 nm EUV chips in October 2018. The company will also begin risk-production of the more advanced 5 nm node in April, staying on schedule. Mass production of 5 nm chips could commence in the first half of 2020.

7 nm EUV mazgas padidina TSMC 7 nm DUV (giliosios ultravioletinės litografijos) mazgą, kuris jau veikia nuo 2018 m. Balandžio mėn. Ir gamina lustus AMD, „Apple“, „HiSilicon“ ir „Xilinx“. Metų sandūroje 7 nm DUV sudarė 9 procentus TSMC siuntų. Naujajam mazgui prisijungus, 7 nm (DUV + EUV) iki 2019 m. Pabaigos galėtų sudaryti 25 procentus TSMC produkcijos.


Source: DigiTimes